Bond pad sharing for powering a multiplicity of electrical components

ABSTRACT

A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

SUMMARY

Embodiments of the disclosure are directed to apparatuses and methodsthat provide for bond pad sharing for powering a plurality of electricalcomponents. According to various embodiments, a system comprises a bondpad set electrically connected to a plurality of electrical componentsand comprising at least one ground pad and at least one electrical bondpad. The at least one electrical bond pad is shared between two or moreof the electrical components. In other embodiments, an apparatuscomprises a bond pad set electrically connected to bias sources andcomprising at least one ground pad and at least one electrical bond pad.A plurality of electrical components is coupled to the bias sources viathe bond pad set. The at least one electrical bond pad is shared betweentwo or more of the electrical components.

In accordance with other embodiments, an apparatus includes a slidercomprising a plurality of electrical bond pads coupled to bias sources.Each of a plurality of electrical components of the slider is coupled toat least one of the electrical bond pads. At least one of the electricalbond pads is a shared electrical bond pad coupled to at least two of theelectrical components.

In further embodiments, an apparatus includes a slider comprising aground pad and a plurality of electrical bond pads coupled to biassources. Each of a plurality of electrical components is coupled to atleast one of the electrical bond pads. A writer is coupled between oneof the electrical bond pads and the ground pad.

According other embodiments, a method comprises biasing a plurality ofelectrical bond pads of a recording transducer. The plurality ofelectrical bond pads is coupled to a plurality of electrical componentsof the recording transducer. The method further comprises activatingselected electrical components of the recording transducer. At least oneof the electrical components shares an electrical bond pad with anotherof the electrical components.

These and other features and aspects of various embodiments may beunderstood in view of the following detailed discussion and accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow diagram showing various processes involving bond padsharing for powering a multiplicity of electrical components inaccordance with embodiments of the disclosure;

FIG. 2 illustrates an embodiment of a recording transducer that does notutilize pad sharing;

FIG. 3 shows a slider comprising a multiplicity of electrical bond padscoupled to bias sources and a number of electrical components eachcoupled to at least one of the electrical bond pads, wherein at leastone of the electrical bond pads is shared between two or more electricalcomponents in accordance with embodiments of the disclosure;

FIG. 4 illustrates a set of bond pads configured for bond pad sharing bya multiplicity of readers in accordance with various embodiments of thedisclosure;

FIGS. 5A and 5B illustrate circuit and block diagram implementations forbond pad sharing by a multiplicity of readers in accordance with variousembodiments of the disclosure;

FIGS. 6A and 6B illustrate circuit and block diagram implementations forbond pad sharing by a sensor and one or more readers in accordance withvarious embodiments of the disclosure;

FIG. 7 is a block diagram showing bond pad sharing by a multiplicity ofreaders in accordance with various embodiments of the disclosure;

FIG. 8 is a circuit diagram of a dual ended writer of a recording head;

FIG. 9 is a circuit diagram of a single ended writer that frees up abond pad of a recording head in accordance with various embodiments ofthe disclosure;

FIG. 10 illustrates a set of bond pads configured for powering a singleended writer and bond pad sharing by a multiplicity of readers inaccordance with various embodiments of the disclosure;

FIG. 11 is a block diagram of a configuration for powering a singleended writer and for effecting bond pad sharing by a sensor and amultiplicity of readers in accordance with various embodiments of thedisclosure;

FIGS. 12A and 12B illustrate circuit and block diagram implementationsfor bond pad sharing by a writer heater and a multiplicity of readers inaccordance with various embodiments of the disclosure;

FIG. 13 is a schematic showing bond pad sharing between three readersconnected in a delta configuration in accordance with variousembodiments of the disclosure; and

FIG. 14 is a block diagram showing bond pad sharing between two heatersin accordance with various embodiments of the disclosure.

DETAILED DESCRIPTION

Data storage systems commonly include one or more transducers that writeand read information to and from a magnetic storage medium. A recordingtransducer, for example, incorporates several distinct electrical and,in some implementations, optical components that require specifiedvoltages/currents to operate properly. Representative examples of suchelectrical transducer components include a reader, a reader heater, awriter, and a writer heater, among other possible components. Somerecording transducers incorporate one or more sensors, such as contactsensors, each requiring specified operating voltages/currents. Each ofthe electrically activated components of a transducer is electricallycoupled to corresponding electrical contacts or bond pads of thetransducer. Depending on the particular design of a given transducer,various bond pads can be configured as voltage sources, current sources,and ground contacts, and can also send and receive signals (e.g., writesignals, readback signals, sensor signals, control signals). Becausebond pads take up appreciable space on a transducer and adding bond padscan be very expensive due to changes in design and fabrication processesneeded to accommodate such additional bond pads, it is desirable tominimize both the number of bond pads and changes to the bond padconfiguration of a transducer.

Embodiments of the disclosure relate to set of bond pads coupled to biassources and a multiplicity of electrical components coupled to the bondpad set, wherein at least one of the bond pads is shared between atleast two of the electrical components. Shared use of a bond pad coupledto a bias source obviates the need for an additional pair of bond padsfor each additional electrical component. For example, bond pad sharingaccording to various embodiments provides for powering N electricalcomponents using N+1 bond pads coupled to bias sources, where eachelectrical component requires two bond pads for proper operation.

Various embodiments of the disclosure are directed to a transducer thatincorporates a set of bond pads coupled to bias sources and amultiplicity of electrical components coupled to the bond pad set,wherein at least one of the bond pads is shared between at least two ofthe electrical components. The transducer can include two or moreelectrically activated components, such as a writer, one or morereaders, one or more heaters, and one or more sensors, for example.

Various embodiments are directed to a transducer that incorporates a setof bond pads coupled to respective DC and AC bias sources and amultiplicity of DC components coupled to the bond pad set, wherein atleast one of the bond pads coupled to a DC bias source is shared betweenat least two of the DC components. Some embodiments are directed to atransducer that incorporates a set of bond pads coupled to respective DCand AC bias sources and a multiplicity of AC components coupled to thebond pad set, wherein at least one of the bond pads coupled to an ACbias source is shared between at least two of the AC components. Otherembodiments are directed to a transducer that incorporates a set of bondpads coupled to respective DC and AC bias sources and a multiplicity ofAC and DC components is coupled to the bond pad set, wherein at leastone of the bond pads is shared between an AC component and a DCcomponent, such as by alternately operating the AC and DC components.

Some embodiments are directed to a transducer that incorporates a set ofbond pads coupled to bias sources and a multiplicity of readers coupledto the bond pad set, wherein at least one of the bond pads is sharedbetween at least two of the readers. Other embodiments are directed to atransducer that incorporates a set of bond pads coupled to bias sources.A multiplicity of readers and at least one sensor are coupled to thebond pad set, and at least one of the bond pads is shared between atleast one reader and at least one sensor. Further embodiments aredirected to a transducer that incorporates a set of bond pads coupled tobias sources. At least one reader and at least one writer heater arecoupled to the bond pad set, and at least one of the bond pads is sharedbetween at least one reader and at least one writer heater.

Some embodiments are directed to a transducer that incorporates a set ofbond pads coupled to bias sources and at least three readers coupled tothe bond pad set, wherein three of the bond pads are shared between thethree readers. Still other embodiments are directed to a transducer thatincorporates a set of bond pads coupled to bias sources and amultiplicity of heaters, including at least one writer heater and atleast one reader heater each coupled to the bond pad set via arespective diode. Two of the bond pads are shared between the at leastone writer heater and at least one reader heater, with current flowingalternately through the at least one writer heater and at least onereader heater based on the conductance state of the diodes. Someembodiments are directed to a transducer that incorporates a set of bondpads coupled to bias sources and a writer coupled to one of the bondpads and ground. A single-ended writer coupled between one bond pad andground is well-suited for incorporation in a heat-assisted orthermally-assisted magnetic recording head (e.g., a HAMR or TAMR head).

As discussed above and further described hereinbelow, some embodimentsof the disclosure are directed to an apparatus configured to provide padsharing between a multiplicity of readers. Multiple readers offer thepotential for increasing drive read data rate and/or areal density. Eachadditional reader requires additional bond pads to connect it to itsassociated bias source. By sharing a bond pad between at least one ofthe readers and another component, such as another reader, a sensor(e.g., contact sensor) or writer heater, the pad count is reduced orminimized, which results in a lower-cost, simplified bond pad layout andslider/head gimbal assembly (HGA) process.

According to some embodiments, a magnetic recording apparatus includes amultiplicity of separately addressable readers, at least two of whichare configured for bond pad sharing. A recording transducer configuredfor bond pad sharing between a multiplicity of readers can beimplemented in a shingled recording system according to variousembodiments. Shingled recording involves writing tracks that overlappart of previously written tracks. The write head includes features suchas high field strength and sharp corner-edge field that can result innarrower tracks. However, existing read transducers may have difficultyreading back these narrower tracks. For example, shrinking the readtransducers in a cross-track direction may decrease signal-to-noiseratio. As a result, two-dimensional magnetic recording (TDMR) isproposed to facilitate reading back data from narrower tracks with aread transducer that is wider than the tracks. In some embodiments, morethan two read transducers are used to implement two-dimensionalrecording and arranged in a transducer array. All of the readtransducers in the array can be centered over respective tracks and,because the read transducers are wider than the tracks, each readtransducer overlaps two adjacent tracks.

An issue with adding additional readers or any electrical feature ingeneral to an existing slider or HGA is the real estate required toplace bond pads which allow access to these new features. Some sliderform factors, for example, can accommodate nine bond pads. In othersliders, a total of ten bond pads is likely feasible. Any increase inbond pad count above nine or ten (depending on the slider/HGA design)likely requires migration to a top bond pad configuration, which is bothmore technically challenging and expensive. An alternative to adding anadditional bond pad above the designed-in pad count is to share anexisting bond pad between two or more electrical devices on the slider.

Sharing a common bond pad between two or more electrical components(e.g., readers) can raises the issue of bias contention as well asdegraded performance (e.g., degraded common mode rejection). Such issuescan be addressed by addition or modification of biasing and filteringcircuitry, although this approach adds some degree of complexity to thedesign. An alternative and simpler approach involves pad sharing betweenelectrical components having the same or similar biasing and/orfiltering requirements. Another example of this approach involves a bondpad shared between electrical components that operate at different timesor can be operated alternately.

One example of this approach involves a bond pad shared between acontact sensor (e.g., a thermal coefficient of resistance (TCR) contactsensor) and a reader. In some embodiments, a contact sensor may not berequired to be active at the same time as a reader, so there is littlerisk of contention on the shared bond pad. A TCR contact sensor and atypical reader, for example, are primarily resistive loads and so theaddition of an extra termination load on the other non-shared reader padwill mostly mitigate any impedance mismatch on the two reader tracesback to the pre-amplifier, thus minimizing the impact of common modenoise.

FIG. 1 is a flow diagram showing various processes involving bond padsharing for powering a multiplicity of electrical components inaccordance with embodiments of the disclosure. The bond pads may, butneed not necessarily, be incorporated in a recording transducer. Theprocesses shown in FIG. 1 involve biasing 102 a set of electrical bondpads, and activating 104 selected electrical components coupled to thebond pads. At least one of the electrical components shares 106 a bondpad with another electrical component. In some embodiments, theelectrical components sharing the bond pad operate alternately 108. Inother embodiments, the electrical components sharing the bond padoperate concurrently 110.

FIG. 2 illustrates an embodiment of a recording transducer that does notutilize pad sharing according to the present disclosure. FIG. 3illustrates a recording transducer that utilizes pad sharing accordingto embodiments of the present disclosure. The bond pad layout shown inFIG. 2 is the same as that shown in FIG. 3, and the electricalcomponents identified as C1-C5 in FIG. 2 are the same as those shown ascomponents C1-C5 in FIG. 3 for purposes of illustration. It isunderstood that the bond pad layout, components, and wiringconfiguration shown in FIGS. 2 and 3 are provided for non-limitingillustrative purposes.

FIG. 2 illustrates a slider 202 that supports a recording transducercomprising a multiplicity of electrical components (C1-C5) coupled to aset 205 of bond pads (P1-P9). The set 205 of bond pads includes eightelectrical bond pads (P1-P8) and one ground pad (P9, also referred toherein simply as ground). The term “electrical bond pad” refers to abond pad that is coupled to a bias source, such as a voltage or currentsource (AC or DC), that provides power for an electrical component. Theslider 202 shown in FIG. 2 utilizes eight electrical bond pads (P1-P8)to power five electrical components (C1-C5).

Electrical components C1-C3 can be referred to as dual-ended components,since each is coupled between a pair of electrical bond pads (e.g., oneend of C1 is connected to negative pad P1 and the other end of C1 isconnected to positive pad P2). Each dual-ended component requires twoelectrical bond pads for proper operation. Electrical components C4 andC5 can be referred to as single-ended components, since each is coupledbetween a single electrical bond pad and ground (e.g., one end of C5 isconnected to positive pad P8 and the other end of C5 is connected toground pad P9). Each single-ended component requires one electrical bondpad for proper operation. It is noted that the polarity of theelectrical bond pads can change during operation, such that a given padcan be at a positive potential during one operating state and at anegative potential during another operating state. Similarly, thepolarity of other components shown in the figures, such as drivers andpre-amplifiers (see, e.g., FIGS. 4-14), can change during operation.

FIG. 3 shows an apparatus according to various embodiments that includesa slider 302 comprising a plurality of electrical bond pads coupled tobias sources 305. The slider 302 further comprises a plurality ofelectrical components each coupled to at least one of the electricalbond pads. At least one of the electrical bond pads is shared between aplurality of the electrical components. According to some embodiments,the slider 302 supports a recording transducer comprising a multiplicityof electrical components (C1-C7) coupled to a set 305 of bond pads(P1-P9). As previously discussed, the set 305 of bond pads is the sameas the bond pad set 205 shown in FIG. 2 (i.e., 8 electrical bond padsand 1 ground pad). In contrast to the slider 205 illustrated in FIG. 2which supports five electrical components using eight electrical bondpads, the slider 305 shown in FIG. 3 supports seven electricalcomponents while using the same number (i.e., 8) of electrical bondpads.

In FIG. 3, electrical bond pad P2 is shared between electricalcomponents C1 and C6, thereby freeing up one electrical bond pad forother use or elimination. The electrical component C2 in FIG. 3, whichperforms the same function as C2 in FIG. 2, is implemented as asingle-ended component, thereby freeing up one electrical bond pad forother use or elimination. By freeing up two electrical bond pads in theillustrative slider 302 shown in FIG. 3, two additional components (C6and C7) have been added to the slider 302 as compared to theimplementation illustrated in FIG. 2.

FIGS. 4-16 illustrate different implementations of bond pad sharing forpowering a multiplicity of electrical components in accordance withvarious embodiments of the disclosure. FIGS. 4-5B are directed toimplementations that provide for bond pad sharing between a multiplicityof readers in accordance with various embodiments. FIG. 4 is arepresentative bond pad layout 402 that facilitates bond pad sharingbetween two readers, and includes nine electrical bond pads and a groundpad. The bond pads shown in the representative layout 402 of FIG. 4include: one electrical bond pad for each of a writer heater and areader heater (both of which also share a ground pad to complete eachcircuit); three electrical bond pads (one of which is shared) for tworeaders; two electrical bond pads for a sensor (e.g., a dual-ended TCRsensor); a ground pad; and a bond pad pair for a dual-ended writer.

FIG. 5A is a schematic showing bond pad sharing between two readers inaccordance with various embodiments. FIG. 5B is a block diagram showingbond pad sharing between the two readers of FIG. 5A according to variousembodiments. In FIGS. 5A and 5B, two readers, R1 and R2, are coupled tothree electrical bond pads, P1-P3. The electrical bond pads, P1-P3, arecoupled to bias sources 504, such as DC current sources. The blockdiagram shown in FIG. 5B can include additional electrical bond pads,represented by bond pad(s) Pn, which provides connection to otherelectrical components. The two readers, R1 and R2, share a commonelectrical bond pad, P2. Each of the readers, R1 and R2, is coupled to apre-amplifier, A and B, respectively. Read-back signals amplified and/orfiltered by pre-amplifiers A and B are communicated to downstream readchannel circuitry for further processing. It is to be understood thatthe pre-amplifiers and bias sources illustrated in FIG. 5B and otherfigures are shown as separate components for purposes of illustrationand not of limitation. In some embodiments, the pre-amplifiers and biassources may be integral to one or more common components (e.g., thepre-amplifiers/drivers are also the bias sources) or may be implementedas separate components.

FIGS. 6A and 6B are directed to implementations that provide for bondpad sharing between a sensor and at least one reader in accordance withvarious embodiments. FIG. 6A is a schematic showing bond pad sharingbetween a sensor and one or more readers in accordance with variousembodiments. FIG. 6B is a block diagram showing bond pad sharing betweenthe sensor and a single reader shown in FIG. 6A according to variousembodiments. In FIGS. 6A and 6B, a sensor, S1, is coupled between twoelectrical bond pads, P1 and P2. The sensor, S1, may be any type ofsensor, such as a TCR contact sensor or a thermocouple. A reader, R1, iscoupled between two electrical bond pads, P3 and shared pad P2. In someembodiments, a dummy sensor, DS1, can be incorporated into the circuitryto facilitate load balancing. The pad sharing implementation shown inFIGS. 6A and 6B reduces the needed electrical bond pad count by one bondpad when compared to an implementation that does not utilize bond padsharing in accordance with embodiments of the present disclosure.

The electrical bond pads, P1-P3, are coupled to bias sources 604, suchas DC current sources. The diagram shown in FIGS. 6A and 6B can includeadditional electrical bond pads, represented by bond pad(s) Pn, whichprovides connection to other electrical components (e.g., additionalreaders). The reader, R1, and the sensor, S1, are coupled topre-amplifiers, A and C, respectively. Read-back and sensor signalsamplified and/or filtered by pre-amplifiers A and B are respectivelycommunicated to downstream circuitry for further processing.

FIG. 7 is a block diagram showing bond pad sharing between a sensor andthree readers in accordance with various embodiments. In theillustrative embodiment shown in FIG. 7, a sensor, S1, and a reader, R1,are coupled to a shared bond pad, P2. Readers R1 and R2 are coupled toshared bond pad P3 via optional dummy sensors DS1 and DS2 (i.e., loadbalancing elements), respectively. Readers R2 and R3 are coupled toshared bond pad P4, with reader R3 also coupled to bond pad P5 viaoptional dummy sensors DS3 (i.e., a load balancing element). In someembodiments, reader R1 coupled to the shared electrical bond pad P2 isconfigured to operate at times when the contact sensor S1 is notoperating, while at least one of the other readers (e.g., R3) isconfigured to operate at times when the contact sensor S1 is operating.Other electrically active components can be included in the blockdiagram of FIG. 7, as indicated by the electrical component(s) Pn.

FIG. 8 illustrates a schematic of a writer, W, coupled to writercircuitry, A, via a pair of electrical bond pads, P1 and P2. In FIG. 8,the writer, W, is implemented as a dual-ended electrical component,requiring two electrical bond pads, P1 and P2. In accordance withvarious embodiments, and as shown in FIG. 9, a single-ended writer, W,is implemented which requires only a single electrical bond pad, P1, forproper operation. In particular, one end of writer W is coupled toelectrical bond pad P1, and the other end of writer W is coupled toground.

A single-ended writer of the type shown in FIG. 9 can be implemented ina slider comprising a bond pad set such as that illustrated in FIG. 10.FIG. 10 is a representative bond pad layout 1002 that frees up oneelectrical bond pad (e.g., a negative writer pad) due to incorporationof a single-ended writer according to various embodiments. The bond padsshown in the representative layout 1002 of FIG. 10 include: oneelectrical bond pad for each of a writer heater and a reader heater(both of which also share a ground pad to complete each circuit); fourelectrical bond pads for two readers; one electrical bond pad for eachof two sensors (e.g., single-ended TCR sensors); a ground pad; and awriter bond pad for powering a single-ended writer, which is coupledbetween the writer bond pad and a ground pad.

An apparatus, according to various embodiments and as illustrated inFIG. 11, can include a slider comprising a ground pad (P6 GND) and aplurality of electrical bond pads (P1-P5 and P7-Pn) coupled to biassources 1104. The apparatus can further include a plurality ofelectrical components (S1, S2, R1, R2, W, etc.) of the slider eachcoupled to at least one of the electrical bond pads. A writer, W, of theslider is coupled between one of the electrical bond pads, P7, and theground pad, P6. In some embodiments, the plurality of electrical bondpads can have a layout the same as, or similar to, that shown in FIG.10. The implementation shown in FIG. 11 frees up one electrical bond padby utilizing a single-ended writer, W, and one additional electricalbond pad by pad sharing between the two readers, R1 and R2. It is notedthat the implementation shown in FIG. 11 includes a dual-ended sensor,S1, and a single-ended sensor, S2, for illustrative purposes.

FIGS. 12A and 12B are directed to implementations that provide for bondpad sharing between a writer heater and at least one reader inaccordance with various embodiments. FIG. 12A is a schematic showingbond pad sharing between a writer heater and one or more readers inaccordance with various embodiments. FIG. 12B is a block diagram showingbond pad sharing between a writer heater and three readers according tovarious embodiments. In FIGS. 12A and 12B, a writer heater, Hw, iscoupled between two electrical bond pads, P1 and P2. The writer heater,Hw, may be any type of heating element, such as a resistive heatingelement. As is best seen in FIG. 12B, each of three readers (R1, R2, R3)has one end coupled to an individual electrical bond pad (P2, P3, P4)and the other end coupled to a shared electrical bond pad, P2. In therepresentative configuration shown in FIG. 12B, implementing pad sharingbetween multiple readers according to various embodiments results in anet reduction in electrical pad count. For example, each of the writerheater, Hw, and three readers, R1-R3, can each be connected to twoindividual electrical bond pads, thereby requiring a total of eightelectrical bond pads. The pad sharing implementation shown in FIG. 12Butilizes only five electrical bond pads (P1-P5) for biasing writerheater Hw and three readers R1-R3, thereby freeing up three electricalbond pads for other use or elimination.

FIG. 13 is a schematic showing bond pad sharing between three readers inaccordance with various embodiments. In FIG. 13, three readers, R1, R2,and R3, are each coupled to two of a total of three electrical bondpads, P1, P2, and P3. The multiple reader configuration shown in FIG. 13can be referred to as a “delta” configuration, in which pairs of thethree readers (e.g., Reader_1 and Reader_2) are coupled to one of threeshared electrical bond pads (e.g., P2). The pad sharing implementationshown in FIG. 13 utilizes only three electrical bond pads (P1-P3),whereas a conventional connection approach requires six electrical bondpads, thereby freeing up three electrical bond pads for other use orelimination. The delta reader configuration shown in FIG. 13 can beimplemented in a slider having a bond pad layout the same as, or similarto, that shown in FIG. 4 (e.g., a bond pad set that includes 3electrical bond pads for the 3 readers).

FIG. 14 is a block diagram showing bond pad sharing between two heatersin accordance with various embodiments. In the representative embodimentillustrated in FIG. 14, a writer heater, Hw, and a reader heater, Hr,are coupled in parallel between two shared electrical bond pads, P1 andP2. Each of the writer and reader heaters, Hw and Hr, is coupled inseries to a respective diode, 1404 and 1406. The writer and readerheaters, Hw and Hr, are configured to operate alternately depending onthe direction of current flow between the two shared electrical bondpads, P1 and P2. For example, when current flows from bond pad P2(positive) to bond pad P1 (negative), diode 1404 is forward biased(i.e., operates in a conductance state) while diode 1406 is reversedbiased, resulting in current flow through the writer heater, Hw, but notthrough the reader heater, Hr. Contrastingly, when current flows frombond pad P1 (positive, not shown) to bond pad P2 (negative, not shown),diode 1406 is forward biased (i.e., operates in a conductance state)while diode 1404 is reversed biased, resulting in current flow throughthe reader heater, Hr, but not through the writer heater, Hw.

It is to be understood that even though numerous characteristics ofvarious embodiments have been set forth in the foregoing description,together with details of the structure and function of variousembodiments, this detailed description is illustrative only, and changesmay be made in detail, especially in matters of structure andarrangements of parts illustrated by the various embodiments to the fullextent indicated by the broad general meaning of the terms in which theappended claims are expressed.

1. An apparatus, comprising: a slider comprising a plurality ofelectrical bond pads coupled to bias sources; a plurality of electricalcomponents of the slider each coupled to at least one of the electricalbond pads; and at least one of the electrical bond pads is a sharedelectrical bond pad coupled to at least two of the electricalcomponents.
 2. The apparatus of claim 1, wherein: n defines a totalnumber of the electrical components; and n+1 defines a total number ofthe electrical bond pads.
 3. The apparatus of claim 1, wherein theplurality of electrical components coupled to the shared electrical bondpad are configured to operate alternately with respect to one another.4. The apparatus of claim 1, wherein the plurality of electricalcomponents coupled to the shared electrical bond pad are configured tooperate concurrently with respect to one another.
 5. The apparatus ofclaim 1, wherein: the plurality of electrical components comprises atleast two readers; and the at least two readers are coupled to theshared electrical bond pad.
 6. The apparatus of claim 1, wherein: theplurality of electrical components comprises at least two readers and atleast one contact sensor; and the contact sensor and one of the at leasttwo readers are coupled to the shared electrical bond pad.
 7. Theapparatus of claim 6, wherein: the one reader coupled to the sharedelectrical bond pad is configured to operate at times when the contactsensor is not operating; and the other of the at least two readers isconfigured to operate at times when the contact sensor is operating. 8.The apparatus of claim 6, wherein the slider comprises a dummy contactsensor coupled to the one of the at least two readers coupled to theshared electrical bond pad.
 9. The apparatus of claim 1, wherein theplurality of electrical components comprises a writer; and the writer iscoupled between one of the electrical bond pads and a ground.
 10. Theapparatus of claim 1, wherein: the plurality of electrical componentscomprises a writer heater and at least two readers; and the writerheater and one of the at least two readers are coupled to the sharedelectrical bond pad.
 11. The apparatus of claim 1, wherein: theplurality of electrical components comprises three readers, and pairs ofthe three readers are coupled to one of three shared electrical bondpads.
 12. The apparatus of claim 1, wherein: the plurality of electricalcomponents comprises a writer heater and a reader heater; and the writerheater and reader heater are coupled to the shared electrical bond pad.13. The apparatus of claim 12, wherein: the writer heater and readerheater are coupled in parallel between the two shared electrical bondpads; and each of the writer and reader heaters is coupled in series toa respective diode, the writer and reader heaters configured to operatealternately depending on the direction of current flow between the twoshared electrical bond pads.
 14. An apparatus, comprising: a slidercomprising a ground pad and a plurality of electrical bond pads coupledto bias sources; a plurality of electrical components of the slider eachcoupled to at least one of the electrical bond pads; and a writercoupled between one of the electrical bond pads and the ground pad. 15.A method, comprising: biasing a plurality of electrical bond pads of arecording transducer, the plurality of electrical bond pads coupled to aplurality of electrical components of the recording transducer; andactivating selected electrical components of the recording transducer,at least one of the electrical components sharing an electrical bond padwith another of the electrical components.
 16. The method of claim 15,wherein activating comprises activating the selected electricalcomponents for alternating operation.
 17. The method of claim 15,wherein activating comprises activating the selected electricalcomponents for concurrent operation.
 18. A system, comprising: a bondpad set electrically connected to a plurality of electrical componentsand comprising at least one ground pad and at least one electrical bondpad, the at least one electrical bond pad shared between two or more ofthe electrical components.
 19. The system of claim 18, wherein: ndefines a total number of the electrical components; and n+1 defines atotal number of the electrical bond pads.
 20. The system of claim 18,wherein the plurality of electrical components comprises at least tworeaders.